| 학회 |
한국공업화학회 |
| 학술대회 |
2020년 가을 (10/28 ~ 10/30, 광주 김대중컨벤션센터(Kimdaejung Convention Center)) |
| 권호 |
24권 1호 |
| 발표분야 |
포스터-디스플레이 |
| 제목 |
Investigation of Biphenyl-Curing Agents in Epoxy Resin for Superior Insulating Thermally Conductive Composites |
| 초록 |
In this work, we report a novel technique to improve the thermal conductivities of boron nitride (BN)-incorporated epoxy resin composites for superior insulating thermally conductive composites. We successfully synthesized a novel kind of curing agent, diamine with mesogen side group via esterification reaction. We investigate the thermal properties of new diamine as curing agents for improved thermally conductive composites. The obtained composites possess and enhanced thermal conductivity (9.40 W m−1 K−1 for with DGEBA and synthesized diamine/BN-OH composites compared with only 3.01 W m−1K−1 for epoxy resin with DGEBA and normal type of MDA/BN-OH composites at the same 60 vol% loading). Thus, modified BN/epoxy resins composites will solve the problem for high thermal diffusion of the caused by high temperatures inside electronic equipment in the automobile, aerospace, mobile and display sectors. |
| 저자 |
강주희, 임종태, 석웅철, 서민혜, 송호준, 이상국
|
| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy resin; boron nitride; thermal conductivity
|
| E-Mail |
|
