| 초록 |
The aim of this study is to increase thermal conductivity of polyamide-imide (PAI) composites filled with surface-modified hexagonal boron nitride (h-BN). Hexagonal boron nitride is exfoliated by horn-type sonication in five types of solvent such as ethanol, toluene, DMF, NMP, and MEK. The exfoliation of h-BN is effective to enhance thermal conductivity of the composite and to create hydroxyl functional group on the edge of BN. Surface modification has been done on exfoliated BN using different kinds of silane coupling agents having amino, phenyl, epoxide and alkane functional groups which were bonded to hydroxyl group formed on the BN surface. The thermal conductivity of PAI composites filled with 20 wt% surface-modified h-BN was increased up to 2 times. We will present optimal surface modification schemes for obtaining highest thermal conductivity and explain it with a chemical similarity between the functional group and polyamide-imide. |
