| 초록 |
An epoxy resin imidazole system was used to form the adhesives for the anisotropic conducting film (ACF), and a latent curing system was necessary for the ACF. In this study, imidazoles were microencapsulated for the latent curing system by spray-drying method. Polycaprolactone (PCL) was used as the wall material. The permeability of the microcapsules was measured in ethanol. The curing behavior of these microcapsules to epoxy resin was examined using DSC. In the curing reaction, the microcapsule of imidazoles exhibited delayed kinetic behaviors compared to pure imidazoles. And the curing times were estimated at 150 ℃ and 180 ℃ using an indentation method. These microcapsules of imidazoles exhibited a long shelf life. And the blocking of imidazoles was also attempted for the latent curing system. Toluenediisocyanate (TDI) was used as a blocking agent. The curing behavior of these blocked imidazoles to epoxy resin was examined using DSC. |
