| 학회 |
한국고분자학회 |
| 학술대회 |
2011년 가을 (10/06 ~ 10/07, 김대중 컨벤션센터) |
| 권호 |
36권 2호 |
| 발표분야 |
유기전자소자용 소재 및 소자(분자전자소재 부문위원회) |
| 제목 |
Flex Lami-capsulation for organic electronic devices |
| 초록 |
Organic electronic devices can be easily degraded by reaction with moisture or oxygen molecules in the ambient condition. In order to prevent these kinds of degradation from molecules in the air, rigid cover glasses are usually used in encapsulation process for organic electronics. Encapsulation process has become a necessarily required process in recent organic devices for enhancing device durability. However, conventional encapsulation using a rigid cover glass and large amount of desiccants has critical drawbacks such as non-flexibility, need of desiccant, and incompatibility with roll-to-roll processing. We report novel encapsulation method(Flex Lami-capsulation) using thin metal foils coated with a polymer. Devices with the Flex Lami-capsulation exhibit similar durability compared with that of glass encapsulation. The Flex Lami-capsulation can be a useful method to passivate flexible displays or organic devices during roll-to-roll process. |
| 저자 |
박민호, 김호범, 임경근, 이태우
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| 소속 |
포항공과대 |
| 키워드 |
passivation; organic light emitting diodes; encapsulation; roll-to-roll; lamination; flexible electronics
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| E-Mail |
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