| 학회 | 한국고분자학회 |
| 학술대회 | 2003년 봄 (04/11 ~ 04/12, 연세대학교) |
| 권호 | 28권 1호, p.120 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | The Reliability Estimation in Hot-melt Adhesives for Automobile Lamps |
| 초록 | The bondings had been used as very important skills in assembling components and materials. Recently, the reliability estimation which evaluated the life and the durability in these bondings of assemblies and products became more significant in relation to PL (Product Liability) and the long-term qualities of products. The objective of this work was to evaluate the reliability of the hot-melt adhesives, non-structural adhesives below 8MPa (adhesive strength), used for head-lamps, rear-lamps, fog-lamps and side-reflectors in automobile lamps. The functions of these hot-melt adhesives were bonding between housing and lens as well as protecting the lamps against the moisture and the heat of surroundings. owing to the decrease of properties such as adhesive strength and sealing, the aging hot-melt adhesive resulted in the failures of automobile lamps. The reliability estimation of hot-melt adhesives was composed of the environmental test and the durability test. and this was conducted under single-stress, for example, heat, humidity, vibration, chemical reagents and thermal shock. and that was conducted under multi-stresses for evaluating the life. This work were studied in order to establish the standard for evaluating the reliability, to estimate the degree of degradation with environmental aging, and to predict the life with the statistical approach in hot-melt adhesives for automobile lamps. |
| 저자 | 형신종;송시용;이종배;변두진;최길영 |
| 소속 | 한국화학(연) |
| 키워드 | 0405 |
