| 학회 |
한국고분자학회 |
| 학술대회 |
2015년 가을 (10/06 ~ 10/08, 대구컨벤션센터(EXCO)) |
| 권호 |
40권 2호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Effect of Surface Treatment of Copper on the Thermal Conductivity of Copper/Epoxy Composites |
| 초록 |
The composites were prepared by mixing the epoxy resin with copper powder at room temperature. The copper powders were dipped in 10% HNO3 solution, to remove native oxide layers on the surfaces of the Cu powders. The Cu-filled composites through the proper selection of the coupling agent and the in-situ mixing with epoxy resin. The effects of oxide layer of copper powder on the morphology and thermal conductivity of Cu/epoxy composites were investigated. The results show the removal of oxide layer and surface treatment can efficiently improve the thermal conductivity of the Cu/epoxy composites. The thermal conductivity of Cu (30 wt%)/epoxy composites was improved by 132% compared to that of the unfilled composites |
| 저자 |
김성룡, vuminhcanh, 배영한
|
| 소속 |
한국교통대 |
| 키워드 |
thermal conductivity; epoxy; copper
|
| E-Mail |
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