| 학회 |
한국재료학회 |
| 학술대회 |
2008년 가을 (11/07 ~ 11/07, 차세대융합기술연구원) |
| 권호 |
14권 2호 |
| 발표분야 |
전자재료 |
| 제목 |
Improvement of the via hole structure by constrained sintering |
| 초록 |
Constrained sintering of low temperature cofired ceramic (LTCC) has gained increasing attention for the precise control and maintenance of sintering shrinkage and tight dimensional tolerances. One of the general techniques of constrained sintering is to use alumina green tapes as constraining layers. The shrinkage in the x–y planes of the devices is minimized because of the friction force between the alumina layers and the device. But the friction force usually become weak around the discontinuous boundary of the substrate such as the edge of the substrate or the border of via hole, and consequently via hole size after sintering become larger than that before sintering. The increase of via diameter causes several defects in via hole such as projection, void, pore, etc. In order to enhance the constraining force around via hole, α-Al2O3 thick films were grown on via hole and its vicinity by aerosol deposition at room temperature. The constraining force assisted by aerosol deposition could be enhanced enough to prevent via hole from increasing in diameter. As a result, defects such as projection, void, and pore around via hole conspicuously decreased. |
| 저자 |
Beom-Joon1, Cho2, Eun-Tae1, Park2, Young-Joon3, Yoon3, Jong-hee Kim
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| 소속 |
1Samsung Electro-Mechanics Co., 2LTD., 3Korea Institute of Ceramic Engineering & Technology |
| 키워드 |
LTCC; via; constrained; aerosol deposition
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| E-Mail |
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