| 초록 |
Flexible Electronics have received increasing attention owing to its thin, light weight, foldable and non-breaking properties. In order to commercialize flexible electronic devices, it is imperative to develop the packaging process that provides signal and power distribution, heat dissipation, and protection for the application of practical industry. Despite the importance of packing process in flexible electronics, the packing-completed flexible electronics devices have not investigated thus far. In this study, we present a simple but effective approach, using flip-chip bonding method with anisotropic conductive film (ACF), for attaching and interconnecting LSI to the flexible circuit board directly, followed by the sacrificial layer etching process. By using this method, we demonstrated flexible NAND flash memory with packaging process completed, and we are also currently investigating the roll-to-roll process to facilitate mass production. |
