| 학회 |
한국공업화학회 |
| 학술대회 |
2016년 가을 (10/26 ~ 10/28, 제주국제컨벤션센터(ICCJEJU)) |
| 권호 |
20권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Curing Property and Characteristics of Low-Temperature and Fast Curing using Mercaptan Hardener for IT Epoxy Adhesive |
| 초록 |
Epoxy adhesive is superior mechanical properties after curing. For instance, it is excellent in adhesive strength, heat resistance and electrical insulation properties. Epoxy adhesive is used to utilize from large to small equipment in the IT field. Especially, LEDs lens attached to small devices, make to light bright smooth, is required for devices such as opto-electronic devices. So, the heat sensitive material such as polymeric material is needed low-temperature and fast curing. In this paper, we studied the curing behaviors of Bisphenol A diglycidyl ether (DGEBA) with modification of mercaptan hardener. We used mercaptan polymer according to the number of –SH functional groups for low-temperature and fast curing. The curing property was analyzed by Differential Scanning Calorimetry (DSC) and Rheometer. |
| 저자 |
강주희, 강호용, 나영재, 석웅철, 권세진, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
IT Epoxy adhesive; Hardener; Mercaptan; Low-Temperature and Fast Curing
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| E-Mail |
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