| 학회 |
한국재료학회 |
| 학술대회 |
2017년 봄 (05/17 ~ 05/19, 목포 현대호텔) |
| 권호 |
23권 1호 |
| 발표분야 |
B. 나노화학/바이오 분과 |
| 제목 |
Aluminum Nitride Thick Films Coated Al Substrates as Heat Sink for High Power Electronic Packages |
| 초록 |
With enhanced performance requirements for more compact, miniaturized, and high-density electronic packages, considerable attention has been given to the heat dissipation problem of electronic systems. For effective heat dissipation in high-power electronic packages, aluminum nitride (AlN) thick films as thermally conductive dielectric layers were developed on an Al substrate using aerosol deposition(AD) and granule spray in vacuum(GSV). The electrical and thermal properties of AlN GSV films are compared to those of AlN AD films. Furthermore, the thermal resistance was significantly reduced and heat dissipation capacity was remarkably enhanced by using AlN GSV films instead of AlN bulk-ceramics in electronic packages, indicating that AlN GSV films coated on Al substrate would be powerfully used as heat sink. |
| 저자 |
한병동1, 김유나2, 안철우1, 최종진1, 류정호1, 김종우1, 황건태1, 윤운하1, 박동수1, 윤석영2
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| 소속 |
1재료(연), 2부산대 |
| 키워드 |
AlN; Thick film; Heat sink; Thermal conductivity
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| E-Mail |
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