| 초록 |
Recently, electrochemical processes (electrodeposition and electroless deposition) have been widely used in electronic industries including computer read/write heads, microelectromechanical systems (MEMS), ultra-large-scale integration (ULSI) devices, and electronic circuit packaging. The electrochemical processes have many advantages over vacuum processes because of room temperature operation, various deposition parameters, easy scale up and maintenance, low cost, relatively rapid deposition rate, the capability of handling complex geometries, and the ability to “tailor” deposit structure and properties. Numerous studies have been carried out to develop binary and ternary magnetic thin films of the iron-group metals (Fe, Co and Ni) because of potential applications in high density recording media and microelectromechanical systems (MEMS). Magnetic materials have recently been incorporated into MEMS devices (e.g. microactuators, sensors, micromotors and frictionless microgears) because electro-magnetic-actuated MEMS are more durable for high force applications and in severe environments compared with electrostatic-actuated MEMS. In this work, the changes of surface characteristics of CoNi and CoNiP thin films electrodeposited from chloride, sulfate, sulfamate baths with varying cobalt concentration, pH, and current density were studied. The rest of detailed test results will be further discussed. |
