| 초록 |
Polyimides are used as dielectric layers in a various microelectronic applications because of their good processability, low dielectric constant, high thermal stability, low moisture absorption and good mechanical properties. However, the adhesive property between polyimide film and copper is poor due to the inactivity of polyimide surfaces. In this work, Upilex-S(R) film surfaces were modified by aqueous KOH solutions at various conditions to yield potassium polyamates. subsequently, they reacted with dilute HCl solutions to convert it into polyamic acids. The resulting polyimide films have active sites, so it's possible to react with coupling agents to improve the adhesion properties. Surface chemistry and morphological changes of films were analyzed by X-ray photoelectron spectroscopy (XPS), attenuated total reflection spectroscopy (ATR), scanning electron microscopy (SEM) and atomic force microscopy (AFM). |
