| 학회 |
한국고분자학회 |
| 학술대회 |
2002년 봄 (04/12 ~ 04/13, 서울대학교) |
| 권호 |
27권 1호, p.113 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
Effect of Film Preparation Conditions on The Properties of Polyimide Film |
| 초록 |
Polyimides have gained increasing importance in the microelectronic industry because of their high temperature properties, low dielectric constants, and desirable mechanical properties. In this study, the effect for improvement of the mechanical properties of the polyimide film were investigated with the variation of film formation conditions such as residual solvent, curing temperature, and stretching ratio. We synthesized PMDA-ODA based polyimide precursor and prepared the film using adjustable applicator followed by biaxial stretching. The morphology of the prepared polyimide film were analyzed using X-ray diffraction. And the thermo-mechanical properties were evaluated by DSC, TGA, UTM, etc. |
| 저자 |
박준상1, 김현석2, 원종찬3, 김석제, 이광섭*, 김용원**, 원동영**, 최길영
|
| 소속 |
1한국화학(연), 2*한남대, 3**SKC(주) Film(연) |
| 키워드 |
|
| E-Mail |
|
