| 학회 | 한국공업화학회 |
| 학술대회 | 2017년 가을 (11/08 ~ 11/10, 부산 벡스코(BEXCO)) |
| 권호 | 21권 2호 |
| 발표분야 | (산학연협력) 플렉서블 일렉트로닉스용 핵심소재 및 공정 |
| 제목 | Colorless Polyimide for Flexible Substrate |
| 초록 | Flexible electronics have attracted people's huge interests, mainly due to their unique features such as lightness, thinness and design freedom. In addition, they can be manufactured through roll to roll process, which can bring dramatic manufacturing cost-down. Flexible displays have been known to be one of the most promising flexible electronics. KOLON has developed "Colorless Polyimide (CPITM)", which has no color and high thermal stability unlike conventional polyimides. They can be used as not only a bottom substrate for flexible transparent display but also a cover window. We have been also developing CPITM solution as a bottom substrate for transparent, flexible displays. Current academic and industrial R&D on materials for flexible electronics will be discussed especially focusing on flexible displays. |
| 저자 | 김상균 |
| 소속 | 코오롱 인더스트리 |
| 키워드 | flexible electronics; thermal stability; substrate |
