| 학회 |
한국공업화학회 |
| 학술대회 |
2019년 봄 (05/01 ~ 05/03, 부산 벡스코(BEXCO)) |
| 권호 |
23권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Study on the Correlation Between Heat-peelable Property of Acrylic Pressure Sensitive Adhesives and h-BN particles |
| 초록 |
Boron nitride (BN) is a substance having a hexagonal system structure with a strong covalent bond between nitrogen and boron and has excellent thermal conductivity, electrical insulation and heat resistance. In addition, as it has a layered structure, it has been widely used as an insulating and heat-dissipating materials as filler. In this study, we focused on heat-dissipative property as filler and have conducted an experiment to improve the heat-peeling property of acrylic pressure-sensitive adhesives (acrylic PSAs) by introducing BN particles. The BN particles were added by 0.1~5wt%, Heat-peelable acrylic PSAs were characterized by FT-IR, TGA, SEM and peel tester (rt, 150˚C). As a result, it was confirmed that when the BN was added by 5wt% or more, the heat-peeling property was improved by about 10%. |
| 저자 |
송민성, 석웅철, 임종태, 권세진, 강주희, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
Heat-peeling; acrylic PSAs; boron nitride
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| E-Mail |
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