| 초록 |
Heat sinks are the most widely used in thermal management systems, however the heat dissipation efficiency is usually limited. Therefore, in this study, in order to increase heat dissipation efficiency of the heat sink, heat dissipating paint using 2D materials (hBN and graphene) as a thermal conductive additive was designed and evaluated. The heat dissipation performance of the paint was calculated from the temperature difference between the paint-coated and -uncoated specimens mounted on the heat source. The highest heat dissipation performance was obtained when the ratio of hBN to resin was 1/10 in the paint using hBN as the thermally conductive filler, and it was able to further reduce the temperature of the test specimen by 6.5oC. In the paint prepared with graphene as a thermally conductive filler, the highest heat dissipation performance was achieved at a 1/50 ratio of graphene to the resin, and a 6.5oC reduction was achieved. |
