| 학회 |
한국고분자학회 |
| 학술대회 |
2019년 봄 (04/10 ~ 04/12, 부산컨벤션센터(BEXCO)) |
| 권호 |
44권 1호 |
| 발표분야 |
고분자가공/복합재료 |
| 제목 |
Preparation and thermal conductivity of poly(imide-siloxane) via a hybrid of micro- and nano-sized Al2O3 |
| 초록 |
In recent years, smart electronic devices such as smart watches, cellular phones, and tablet PCs have become smaller and lighter. In addition, as the performance of miniaturized devices is further improved, the problem of heat generation of smaller devices is also emerging. Therefore, heat-dissipating materials have recently been actively researched. We prepared poly(imide-siloxane) copolymers by combining polyimide with superior thermal properties and silicone polymer with flexibility. The cheap and commercially available Al2O3 (alumina) was used as a heat-dissipating filler. The alumina, controlled by the appropriate ratio of micro- and nano-sized, was added to the copolymer matrix. The polymer property and the thermal conductivity of the poly(imide-siloxane) composite films were studied. |
| 저자 |
최주영, 남경남, 진승원, 김동민, 송인호, 박형주, 정찬문
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| 소속 |
연세대 |
| 키워드 |
poly(imide-siloxane) copolymer; Al2O3; thermal conductivity; heat-dissipating
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| E-Mail |
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