| 학회 | 한국화학공학회 |
| 학술대회 | 1999년 봄 (04/23 ~ 04/24, 성균관대학교) |
| 권호 | 5권 1호, p.1773 |
| 발표분야 | 재료 |
| 제목 | 공중합 폴리이미드의 응력 거동 해석 |
| 초록 | Copolymerization method may be used to show low stress and to have excellent mechanical properties and low water sorption as microelectronic devices. The main focus of this work was on linear polyimide containing the bulky di(trifluoromethyl) moiety. Copolymer was prepared combining 1, 4-phenylenediamine (PDA) with 1, 2, 4, 5-Benzenetetracarboxylic dianhydride (PMDA) and 2, 2’-bis(3, 4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA); the 6FDA units contributed to a lower processing temperature (Tg) and water sorption, and the PDA contributed to a lower TEC. For these thin films, residual stresses were detected in-situ during thermal imidization of the co- and homopolyimide precursors as a function of processing temperature over the range 25~400oC by using Thin Film Stress Analyzer (TFSA). In addition, their relationship between morphological structures and residual stress behaviors depending on 6FDA composition was investigated by X-ray diffraction (WAXD). In this work, we can see that copolyimide can com pensate for the difficulty in process due to high Tg in spite of relatively low stress for rigid PMDA-PDA by using the flexible 6FDA.With 6FDA, PMDA, and PDA, the homopolyamic acids and copolyamic acids were synthesized and thermally converted to the polyimides in thin films. For all the polyimides, both stress and morphological structure were significantly dependent upon the 6FDA composition in the backbone structure. In this study, the ratio of 30:70 (6FDA/PMDA) anhydrides showed relatively low level stress and excellent mechanical strength for microelectronics application. |
| 저자 | 장원봉, 정현수, 조영일, 한학수 |
| 소속 | 연세대 |
| 키워드 | Residual stress; Copolyimide |
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| 원문파일 | 초록 보기 |
