| 학회 | 한국고분자학회 |
| 학술대회 | 2005년 봄 (04/14 ~ 04/15, 전경련회관) |
| 권호 | 30권 1호, p.369 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Stress behaviors and morphological structure of fluorine-containing colorless polyimides derived from 3'-trifluoromethyl-3,4'-oxydianiline |
| 초록 | A colorless fluorinated diamine, 3'-trifluoromethyl-3,4'-oxydianiline(3'F-3,4'ODA) was prepared through the nucleophilic substitution of 3-nitrophenol and 2-chloro-5-nitrobenzotrifluoride by catalytic reduction with hydrazine and Pd/C. A series of Polyimides were synthesized from the diamine with various aromatic dianhydrides via thermal and chemical imidization. The polymer films have good thermal stability with the glass transition temperature of 234-313℃. Some polyimides have excellent adhesion property to copper. When the polyimides were utilized as an adhesive layer among copper, they showed the adhesion strength over 440 N/m in the 90° peel test. For these polyimides, the residual stress were comparatively higher than other typical polyimides. The major factor in determining the magnitude of the stress behavior induced by both the thermal mismatch and water uptake in films should be the morphological factors such as chain rigidity, chain orientation, and crystallinity. Their morphlogical stuctures were examined by wide angle X-ray diffraction and a prism coupler. Acknowledgements : This work was supported by the Ministry of Science Technology Korea through the National Research Laboratory Program and Center of Electronic Packaging Materials of Korea Science and Engineering foundation |
| 저자 | 이호성, 장원봉, 서민범, 설용건, 한학수 |
| 소속 | 연세대 |
| 키워드 | oxydianiline; fluorinated polyimides; colorless; adhesive; residual stress; water uptake; morphological structure |
