| 학회 | 한국고분자학회 |
| 학술대회 | 2004년 가을 (10/08 ~ 10/09, 경북대학교) |
| 권호 | 29권 2호, p.497 |
| 발표분야 | 고분자 구조 및 물성 |
| 제목 | Preparation and Adhesion Properties of 4-Component System Polyimide/ Copper Foil for FCCL |
| 초록 | The substrate of FPCB(flexible printed circuit board) composes a metal foil and a film layer of an aromatic polyimide with an adhesive layer (3-layered FCCL) or without using an adhesive (2-layered FCCL). Generally, 3-layered FCCL manufactured by laminating method, 2-layered FCCL prepared from casting of polyamic acid on copper foil or sputtering on polyimide film. If CTE (coefficient of thermal expansion) value of polyimide film has larger than that of copper foil, curling of CCL board is produced to the copper foil, surface to face outside. In this study, we synthesized polyamic acid having 4-component system which could controlled to the CTE of polyimide. we prepared 3-layered FCCL by laminating method. The CTE was controlled according to the content of BTDA and PDA. As BTDA content increased, dimension stability improved. The peel strength between polyimide film and copper foil was measured above 1.5 kgf/cm. In the solder float test, pin-hole and color change were not observed. Fig. 1. Peel strength (a) and dimension change (b) according to BTDA contents. Reference 1. S. H. Kim, D. W. Woo, and S. H. Jeong, J. Appl. Polym. Sci., 86, 812 (2002). |
| 저자 | 서관식1, 설경일2, 김용석2, 이재흥2, 최길영2, 원종찬2 |
| 소속 | 1공주대, 2한국화학(연) |
| 키워드 | PI/copper foil; FCCL |
