| 초록 |
Nowadays, the production of next generation of electronics which are used in high frequency regions necessitates low dielectric constant materials. For example, the receive frequency of mobile phones range from 1GHz to 10GHz. And in many communication application fields like GPS, TV satellite, their operating frequency is in GHz regions. However, dielectric constant of general epoxy resins is about 3.5. This value is not enough to apply printed circuit boards in next generation of communication electronics. In this study, we fabricate epoxide/SiO2 thermoset composites using liquid crystal epoxide and fluorinated diamines to reduce dielectric constants and dielectric loss. In network analyzer, dielectric properties of LCE composites at 10GHz are improved as their planar properties are increased. |
