| 초록 |
Commercial IC devices are getting very smaller, and heat dissipation is getting higher than ever. So, thermal management of IC devices is one of the most important issue in next generation IC technology. Among many cooling solutions such as TIM, heat spreader, or thermal TSV, liquid cooling is the most attractive solution in terms of cooling efficiency. In this study, a liquid cooling module was fabricated on Si wafer with micro-channel sand TSvs. Three different micro-channel (straight, serpentine, zigzag) with 2 different coolants were examined to investigate the cooling effect of liquid cooling system. Micro-channels and TSVs were formed by DRIE process. Then, Si wafer with micro-channels and TSVs was bonded on a glass wafer by anodic bonding. The coolants used in this study were de-ionized water and diluted ethylene glycol (70 wt%). Pressure drop, curvature of coolant, and temperature differential in different flow rate were measured to analyze the characteristics of our liquid cooling module. |
