| 초록 |
Thin film encapsulation (TFE) which is repetition of organic and inorganic layer is general method for flexible encapsulation. According to the simple stress formula for multilayer thin film, strain on each layer is complexly affected by several factors. Among them distance from neutral plane and effective thickness which means the ratio of elastic modulus of deposited layer and substrate are important. In this study, the thickness of each component of TFE was independently controlled and its effect to flexibility was analysed by comparing experimental and simulation results. TFE was fabricated via alternating depostion of initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD). For organic layer, poly (1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) (pV3D3) and inorganic layer Al2O3 was used. 3D conventional shell model of finite element method was used and the thickness dependent property of inorganic lyaer, critical tensile strain was also measured by three point bending. Flexibility was measured by comparing the water vapor transmission rate (WVTR) before and after bending. |
