| 초록 |
Currently, the application fields of pressure-sensitive adhesives(PSAs) are expanding in various high-technology industries such as the electronic and aerospace industry, in which more advanced performance of PSAs is required. Particularly, electronic devices become more lighter and sophisticated with using high-performance and highly intergrated semiconductors. PSAs that can control bonding and debonding performance are widely used in the silicon wafers processing. The thermal stability of PSAs is very important due to the higher temperature steps during the wafer processing. In this study, fluorene-based curing agent was used to impart thermal stability to the PSAs, in which UV curing was performed to enable bonding and debonding performance. The variation in heat resistance and adhesive strength were studied depending on fluorene-based curing agent content. |
