| 초록 |
Since demand of deformable electronic device increases, fabrication of conformal and thin film is necessary to enhance flexibility. However, bumpy underneath structure and unwanted particles impede quality of thin film. To solve these problems, importance of planarization becomes greater. Planarization can be achieved with flowable polymer, while it should be hardened for following thin film deposition steps. To fulfill these requirements, planarization layer was fabricated with glycidyl acrylate (GA) and 2-(Dimethylamino)ethyl methacrylate (DMAEMA). In this study, copolymer of GA and DMAEMA was synthesized via initiated chemical vapor deposition (iCVD), with low glass transition temperature and reactive epoxy functional group for post-curing. As a result, near 98 % of degree of planarization was achieved with various sub-micron scale patterns. Also, additional epoxy curing reaction was proceeded at 90 ℃, which can be applied to organic electronic devices without thermal degradation. |
