| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 봄 (05/02 ~ 05/04, 대구 엑스코(EXCO)) |
| 권호 |
22권 1호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Preparation and properties of thermosetting adhesive using polymers synthesized by different synthetic methods |
| 초록 |
Epoxy adhesive is widely used in electronic apparatus, it is included in the small parts and devices. In particular, the low-heat-resistant material such as polymeric material is needed fast and low-temperature curing behavior because avoided high temperature exposure. In general, it was well known that the curing reaction at low temperature of the epoxy and thiol is faster than the reaction of the epoxy and amine. In this study, we are studied the adhesive behaviors of diglycidyl ether of bisphenol A (DGEBA) and synthesized thiol-polymer by different methods. We adopted the thiol-polymer with different group and different method in order to enable low-temperature and fast curing. The adhesive properties were analyzed by Differential Scanning Calorimetry (DSC), Gel Permeation Chromatography (GPC) and Matrix-Assisted Laser Desorption Ionization – Time of Flight mass spectrometer (MALDI-TOF). |
| 저자 |
권세진, 강호용, 임종태, 석웅철, 강주희, 송호준, 이상국
|
| 소속 |
한국생산기술(연) |
| 키워드 |
Trifunctional and Difunctional thiol; Sol-Gel process; low temperature curing; fast curing
|
| E-Mail |
|
