| 초록 |
In this work, polyhedral oligomeric silsesquioxane (TP-POSS), which contained trisilanolphenyl functional groups (TP), were used as a filler for epoxy composites. The contents of TP-POSS in epoxy composites were varied within 0, 5, 10, and 15phr and the epoxy/TP-POSS specimens were prepared by curing reaction with imidazole. And, the effect of TP-POSS content on thermal, mechanical, and morphological properties of epoxy/TP-POSS composites was investigated. The thermal stability of the cured specimens was monitored by thermogravimetric analysis (TGA). Also, the critical stress intensity factor (KIC) of the cured specimens was performed to study the mechanical interfacial properties and the morphological fracture surfaces after KIC tests were observed by using a scanning electron microscope (SEM). |
