| 초록 |
The adhesion strength between the photosensitive polyimide (PSPI) and Si wafer is well known to be improved by introducing a silane coupling agent (SCA) as an adhesion promoter. Among the SCAs, γ-aminopropyltriethoxysilane (γ-APS) was commonly used because of its outstanding result in adhesion strength. In this work, N-2-aminoethyl-3-aminopropylmethyldimethoxysilane (AAPS) as well as γ-APS was used as a adhesion promoter and its structures at the interface were adjusted by changing pH and solution concentration to fine the optimum structure for adhesion strength. Design of experiments (DOE), especially 2way-factorial design method was used to determine the optimum pH and concentration for aminosilane solutions. The adhesion strengths between pyromellitic dianhydride-4,4’-oxydianiline polyimide (PMDA-ODA PI) and surface cleaned Si wafer with various aminosilane layers were obtained by 90o peel test at a constant peel late of 5mm/min. |
