| 초록 |
Polyimides have been widely used as buffer layers and dielectric layers for semicinductor devices because of thier excellent properties such as high thermal stabilities, chemical resistance and good mechanical properties. However, polyimides contain carboxylic acid groups in thier backbone, so that they have higher water absoption, dieletric constant, and high solubility against alkali solution. Because of high solubility of polyimides, it is hard to apply photoregist materials. To avoid the weak point of polyimide, polybenzoxazoles (PBO) have received increasing interest in microelectronic industry. Thus, the development of photosensitive PBO was highly anticipated. In this study, several PHAs (polyhydroxyamides), the precursors of PBO, were prepared and the capability as photoregists was estimated. |
