| 초록 |
Stretchable and foldable electronics are emerging as a technology that could be valuable for various applications, such as foldable and wearable display, conformable skins for integrated robotic sensors, and hemispherical detector arrays. Such devices cannot be accomplished with conventional wafer based circuits or even with more recent systems that offer simple mechanical bendability. In this presentation, a new approach to stretchable and folable electronics is demonstrated. These systems combine single-crystal silicon membranes with plastic or elastomeric substrates using transfer-printing method. When ultrathin circuits composed of a thin layer of rigid semiconductor nanomaterial is strongly bonded to an elastomeric substrate, the circuits will relieve applied compressive strains by mechanical buckling. The strategies represent promising routes to high performance stretchable electronic devices that can incorporate established, high performance inorganic electronic materials. |
