화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2016년 봄 (05/02 ~ 05/04, 여수 엑스포 컨벤션)
권호 20권 1호
발표분야 정밀화학_포스터
제목 Boron nitride/silicon carbide binary filler with vertical particle alignment system for high thermal conductive composite
초록 Thermally conductive BN/SiC binary filler and epoxy composite materials were fabricated via magnetic alignment. Owing to its anisotropy, the vertically aligned BN composite had a high thermal conductivity and generated a vertical heat flow path. When the SiC nanoparticles were added to the binary filler, they hindered BN-particle aggregation and led to the formation of a three-dimensional heat conduction path. The maximum thermal conductivity (5.77 W/mK) was obtained with an addition of SiC filler, and was 3.08-fold and 1.1-fold higher than that of randomly mixed BN and vertically aligned BN composites, respectively. The additional SiC-Fe3O4 particles resulted in significant aggregation of the filler, which in turn led to a decrease in the thermal conductivity. The measured storage modulus of the BN-Fe3O4/SiC binary filler composite was also higher than those of the BN-Fe3O4 and BN-Fe3O4/SiC-Fe3O4 composites, owing to the aggregation of particles.
저자 김기호, 김주헌
소속 중앙대
키워드 thermal conductivity; vertical alignment; binary filler
E-Mail