| 초록 |
Wafer backside metalization is one of the process to attach the die to the lead frame. This process is required to have a high quality of electronical, mechanical and thermal properties. Generally Pb alloy and Au-based solder is used to die attachment. But that are very toxic and expensive materials. Thus, it should be replaced eco-friendly and inexpensive materials. The advantages of the transient liquid phase bonding is the low binding process temperature and the high remelting temperature. Sn-Ag alloy, one of various Sn-based alloys, is a candidate material due to low cost, superior wetaability, bonding strength, and fatigue strength. In this study, we conducted die attachment on Cu plated alloy 42, bare Cu and Ag plated bare Cu lead frame, then investigated the surface characteristics by SEM-EDS. |
