| 학회 |
한국재료학회 |
| 학술대회 |
2008년 봄 (05/22 ~ 05/23, 상록리조트) |
| 권호 |
14권 1호 |
| 발표분야 |
반도체재료 |
| 제목 |
Surface characteristics of magnetron sputtered copper films investigated by SEM and AFM |
| 초록 |
Cu metallization has been extensively used for ultra-large scale integrated (ULSI) circuits because of its lower resistivity and superior electromigration resistance compared to Al alloy. The investigations of Cu films have been generally focused on the electrical and microstructural properties of Cu films prepared at various parameters during deposition. On the other hand, most studies have paid no attention to the surface characteristics of Cu thin films during deposition. Therefore, in this presentation, we focus on the surface morphology evaluation of Cu thin films deposited by dc magnetron sputtering using scanning electron microscopy and atomic force microscopy. We also discuss the effect of deposition condition on the electrical resistivity of Cu thin films in detail on the basis of our experimental results. |
| 저자 |
Minh-Tung Le1, 손용운2, 임재원2, N.R. Munirathnam2, 최인혁1, 김철기1, 최국선2
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| 소속 |
1충남대, 2한국지질자원(연) |
| 키워드 |
Copper; Thin film; Magnetron sputtering; AFM; SEM
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| E-Mail |
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