| 초록 |
To decrease the thermal conductivity of epoxy resins, polymer foam is made void in the epoxy resin and their thermal properties are compared with commercial epoxy resin. These void in the epoxy resins made by various materials such as polymer foam, glass bubble. The thermal conductivity of foamed resin are lower than commercial epoxy resin due to the void in the epoxy. The curing temperature with different curing agents of epoxy is examined using differential scanning calorimetry (DSC). To analyze relationship between void size and thermal conductivity, morphologies are observed by scanning electron microscope (SEM) and thermal diffusivity was measured with the laser flash method. |
