| 학회 |
한국고분자학회 |
| 학술대회 |
2009년 가을 (10/08 ~ 10/09, 광주과학기술원 오룡관) |
| 권호 |
34권 2호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
The Effects of Additive on the Dielectric Properties of Polyimide/Polyetherimide Wrapped BaTiO3 Prepared by Wrapping Process Using Precipitation |
| 초록 |
High thermal stability and dielectric properties of polyimide (PI) composites filled with PEI wrapped BaTiO3 (BT) are investigated. The composites are fabricated via thermal curing of PI in PEI/wrapped BT obtained by precipitating the suspension of PEI and BT into methanol as poor solvent for PEI. BT particles were treated by γ-aminopropyltriethoxy-silane(γ-APS). The surface of PEI wrapped BT is measured by high resolution transmission electron microscope (HRTEM) with various additive factor as type, concentration, and so on. The dielectric constant and loss tangent of PEI/PI filled with wrapped BT composites are measured by microwave dielectrometer. The degree of dispersion of additive treated PI composites measured by Brookfield viscometer is shown higher than untreated PI composite. The glass transition temperature (Tg) of PEI/PI composites measured by differential scanning calorimeter (DSC) is shown higher than PEI and lower than PI. |
| 저자 |
김광호1, 장용균1, 원종찬2, 윤호규1
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| 소속 |
1고려대, 2한국화학(연) |
| 키워드 |
Polyimide; Wrapped BT; Thermal stability; Dielectric property; Additive
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| E-Mail |
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