| 초록 |
An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with a lot of imidazoles were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 ℃. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-methylimidazole exhibited the fastest reaction time among the imidazoles used in this study. And cationic cure of epoxy resins is very rapid and has shown potential in significant industrial processes which require fast reaction rates. Benzyltetrahydrothiophenium hexafluoroantimonate and 1-(p-methoxybenzyl)tetrahydrothiophenium hexafluoroantimonate were synthesized, and were used as latent thermal initiators for epoxy resins. The reaction rate of these sulfonium salts were compared with other curing agents such as imidazole derivatives. |
