| 학회 |
한국공업화학회 |
| 학술대회 |
2011년 봄 (05/11 ~ 05/13, 제주국제컨벤션센터) |
| 권호 |
15권 1호 |
| 발표분야 |
접착제.도료.잉크 |
| 제목 |
Variations of wettability and adhesion properties of adhesives for thin silicon wafer by acryl-modified silicone component |
| 초록 |
Various kinds of acrylic copolymers were prepared by using various different molar ratios of silicone prepolymer to acrylic acid (0.1, 0.3, and 0.5). The acryl-modified silicone component played a crucial role in controlling the wettability properties of adhesives on the thin silicon wafer. The effect of acryl-modified silicone of low surface energy on the wettability and the adhesion properties were studied for the pressure sensitive adhesives. |
| 저자 |
유종민1, 김형일1, 장우경1, 방패리1, 김경만2
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| 소속 |
1충남대, 2한국화학(연) |
| 키워드 |
adhesive; wettability; acryl-modified
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| E-Mail |
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