| 초록 |
Microelectromechanical systems (MEMS) is a rapidly growing technology with a broad range of commercial applications and a diverse collection of evolving MEMS sensors and actuators. However, silicon and organic polymers, the most commonly used materials for MEMS today, can not be utilized as the structural materials in harsh conditions. Therefore, it has been concerned to develop new fabrication techniques for triboligical non-oxide ceramic MEMS which is able to use at high temperatures and corrosive circumstances. And it came to our concern that the capillary force lithography (CFL), as a modified imprinting technique with soft PDMS mold is a secure, promising method to achieve large area patterns using polydimethylsiloxane (PDMS) mold. In this study, nano-scale siliconcarbide-based ceramic patterns on Si substrates were fabricated by CFL technique for the first time using a liquid ceramic precursor (KiON VL20, www.kioncorp.com) and CD-R and DVD as economic nano-scale masters. The ceramic patterns were prepared by low temperature (70~90oC) thermal curing with thermal initiators, such as peroxide compounds, followed by high pyrolytic temperature (800oC) in a nitrogen gas atmosphere. And, in order to control the thickness of residual layers which is considerably one of main problems in the imprinting processes, we investigated on the effect of processing parameters such as the concentration of the ceramic precursor and the spinning speed to obtain the optimum film thickness for near-zero residual layers of patterning. Moreover, the etching kinetics of the various polymeric and ceramic patterns is comparatively studied to remove effectively the residual layer by Reactive Ion Etching. |
