| 학회 |
한국고분자학회 |
| 학술대회 |
2008년 봄 (04/10 ~ 04/11, 컨벤션 뷰로(대전)) |
| 권호 |
33권 1호 |
| 발표분야 |
고분자 가공/복합재료 |
| 제목 |
Effects of Inorganic Filler and Glass Fiber-Cloth on Thermal and Mechanical Properties of a liquid Crystalline Polymer Used in PCB Applications |
| 초록 |
Liquid crystalline polymers(LCPs) are attracted in the rapidly advancing circuit board as a next-generation product. Recently LCP is expected to be used for lamination of electronic circuit board because mechanical and electrical properties, such as a low dielectric constant and dimensional stability, However it has not been widely used yet due to reliability performance. The effects of properties such as coefficient of thermal expansion(CTE) and high modulus upon the increase in reliability performance was investigated. Attempts were made to improve the thermal and mechanical properties of liquid crystalline polymer(LCP) for use in advanced printed circuit boaed application throught manipulation of composite. Three different types of fiber-cloth reinforced composites and one inorganic filler composite were tested. As results, the polymer composite with satisfactory thermal and mechanical properties can be obtained. |
| 저자 |
윤금희1, 윤상준2, 이화영2, 김진철2, 박호준2, 오준록2
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| 소속 |
1(주)삼성전기, 2삼성전기 중앙(연) |
| 키워드 |
LCP; Laminate; filler; fabric; CTE; Modulus; PCB; Reinforced; Composite
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| E-Mail |
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