| 초록 |
High power light emitting diodes are now popularly being researched for the potential application. Thermal behavior is one of the important key points to estimate the performance of the LEDs. In this paper, we will apply structure function and profile function, calculate heat flow path area and distance for the packaged LEDs. Structure function is very useful for the dynamic thermal behavior of the semiconductor packages. The profile function is a descendant of the structure function. In our experiments, the packaged LEDs are made up of GaN chip, Sapphire substrate, Al slug, Silver paste and Polymer epoxy. In our calculation, thermal conductivity and volumetric heat capacitance of the materials will be used as parameters. After calculating the heat flow path area and distance, we can compare an equivalent thermal profile with real structure. The comparison picture will imply which section can improve its thermal behavior. |
