| 초록 |
It is important to improve the integration density and performance of semiconductor chip according to the multifunction and small size of electronic products, so that higher thermal resistance, higher moisture resistance, lower thermal expansion coefficient, and lower modulus properties are needed to encapsulation materials for semiconductor. Various methods to solve these problems have been presented, although to date the most economical and effective method has been the high filler loading technique. If this technique were used, however, there should be a concomitantly high viscosity of EMC with the increase of filler content, which causes moldability problems in packaging. Therefore, it is necessary to use the epoxy resin system to ensure low viscosity when this technique is applied. The most efficient epoxy resin for this application is a biphenyl-type epoxy resin, which is characterized by low viscosity, good adhesion and mechanical properties. In this study, the cure kinetics of various biphenyl-type epoxy resin systems according to the change of catalyst were investigated by thermal analysis using DSC. The kinetic parameters of all epoxy resin systems were reported in terms of a generalized kinetic equation that considered the diffusion terms. The good cure properties of these systems were obtained in the systems using latent catalyst.
|
