화학공학소재연구정보센터
학회 한국공업화학회
학술대회 2020년 가을 (10/28 ~ 10/30, 광주 김대중컨벤션센터(Kimdaejung Convention Center))
권호 24권 1호
발표분야 포스터-고분자
제목 Preparation of Polymeric Composites with Low Temperature PCM Microcapsule for Insulation using Photopolymerization 3D Printing
초록 With the market growth of Home meal replacement (HMR) products, the demand for frozen food packaging containers are also increasing significantly. Commonly, the containers are used to plastics due to their low thermal conductivity, but taste and texture of frozen foods are altered because of bigger ice crystal formation during re-froze after defrost. For these reason, phase change materials (PCMs) is mainly used to maintain a constant temperature, but in the case of PCM that can be driven below room temperature, most of evaporation temperature is low within about 100 ℃. But, general packing container process carry out temperature about 120 °C or higher which melting commodity plastics. Therefore, the PCMs cannot be applied by vaporizing all under the process conditions. Accordingly, the work intends to develop a technology that low-temperature PCM microcapsules can be directly compounded by photocuring 3D printing through the formation of pore structures in the polymer matrix.

 
저자 권혁준, 김용수, 이찬민, 이준영, 황기섭
소속 한국생산기술(연)
키워드 Thermal conductivity; PCM; 3D printing
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