| 초록 |
A significant challenge in developing nanoporous low-k materials is the improvement of their mechanical properties as well as low dielectric constant. For the enhanced mechanical properties of the nanoporous dielectrics, both UV and ozone treatments (post-treatments) are very effective due to improved reactivity between matrix and porogen as well as high cross-link density of organosilicates. In addition, UV treatment improves their stability by reducing residual OH group. We prepared nanoporous dielectric films by using organosilicate matrix and chemically reactive porogens. The organosilicate matrix was copolymer of methyl trimethoxysilane (MTMS) and 1,2-bis(triethoxysilyl) ethane (BTESE), and the reactive porogen was trimethoxysilyl xylitol (TMSXT). After post treatments, their mechanical properties greatly increased and their structural changes were confirmed by FT-IR, Si-NMR and contact angle measurements. |
