| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 가을 (10/06 ~ 10/08, 제주 ICC) |
| 권호 |
39권 2호 |
| 발표분야 |
고분자가공/복합재료-자가치유 고분자와 복합소재 |
| 제목 |
Enhanced thermal conductivity of polyimide composite films based on solid exfoliated ℎ-BN by ball milling |
| 초록 |
The use of polymers in electronic devices is increasing for weight loss, low cost, facile processability and high performance. Also, the effective heat release of electronic devices, LED back panel and automobile part becomes important. But polymers have inherently low thermal conductivity (~0.1 W/m.K) and therefore, improving their thermal conductivity is one of the most important issues in these fields. In this work, the idea of the solid exfoliation of hexagonal boron nitride (ℎ-BN) was explored by ball milling with ammonia-borane. The composite films based on polyimide and solid exfoliated ℎ-BN were prepared by a casting method. The composite films from solid exfoliated ℎ-BN exhibit the improved thermal conductivity compared to those from as-received ℎ-BN with retaining the considerable flexibility. |
| 저자 |
하성민, 권오환, 김병각, 김용석, 원종찬, 유영재
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| 소속 |
한국화학(연) |
| 키워드 |
Thermal conductivity; boron nitride
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| E-Mail |
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