| 학회 |
한국공업화학회 |
| 학술대회 |
2018년 가을 (10/31 ~ 11/02, 제주국제컨벤션센터(ICC JEJU)) |
| 권호 |
22권 2호 |
| 발표분야 |
디스플레이_포스터 |
| 제목 |
Preparation of New Diamines with Biphenyl Groups as Hardener for Improved Thermally Conductive Composites |
| 초록 |
By miniaturizing, integrating and functionalizing of modern electronics, the issue of efficient thermal dissipation has been received critical attention to increase performance and reliability of these devises. Recently developments in thermal dissipation have heightened the need for advanced polymeric thermal conductive composite with inexpensive, easy handling, prominent workability and outstanding mechanical properties. However, a major problem with polymers is a low thermal conductivity in the range of 0.10-0.25 W m-1K-1. For the biphenyl system, there are stronger interaction between the molecules due to the double bonds in the phenyl rings. Based on the assumption of mesogenic groups being able to align liquid-crystal (LC) molecules, we have designed a novel epoxy resin bearing biphenyl mesogenic groups and investigate the thermal properties of new diamines with biphenyl groups as hardener for improved thermally conductive composites. |
| 저자 |
강주희, 박성원, 임종태, 석웅철, 권세진, 송호준, 이상국
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| 소속 |
한국생산기술(연) |
| 키워드 |
epoxy resin; diamine; thermal conductivity
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| E-Mail |
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