| 학회 |
한국화학공학회 |
| 학술대회 |
2015년 가을 (10/21 ~ 10/23, 일산 KINTEX) |
| 권호 |
21권 2호, p.1445 |
| 발표분야 |
고분자 |
| 제목 |
Effect of silica on thermal stability of Poly(amide-imide) for Electronic Material |
| 초록 |
Poly(amide-imide) was synthesized at low temperature process to offer a thermaly stable memebrane for electronic material. The high thermal stability with high glass transition temperature could be used to various applications such as semiconductors, integrated circuits, coating materials and display. Thermal stabilities of the polymer was confirmed by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). |
| 저자 |
한학수, 김광인
|
| 소속 |
연세대 |
| 키워드 |
poly(amide-imide); thermal stability; glass transition temperature
|
| E-Mail |
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| 원문파일 |
초록 보기 |
