| 초록 |
Mechanical reliability of epoxy molding compound(EMC) for chip scale package(CSP) is greatly affected by the compound ability to absorb moisture. Moreover, miniaturization with faster, denser, and more complex functionality of the packages materials is an important trend of the present as well as future semiconductor devices. The development of the CSP technology is an major technology of such a trend. The liquid type epoxy resins play a vital role in CSP application as a result of their ease of processing, low cost, low dielectric constant, adhesive properties, and so on. In this study, we have studied the properties of moisture absorption in liquid type epoxy resin systems for CSP according to the change of epoxy resin. Kayahard MCD from Nippon Kayaku Co. was used in these epoxy resin systems as hardeners. The changes of moisture content with time were performed under the conditions of 60℃ and 95% relative humidity. The diffusion coefficients of epoxy resin systems with kinds of epoxy resins were calculated in terms of modified Crank equation based on Fick's law, so that these data could be interpreted in respect of water absorption mechanism and epoxy resin network properties with the changes of epoxy resin. |
