| 초록 |
Porous polyimides with low dielectric constant values were synthesized using hollow silica spheres. Hollow silica spheres were synthesized via a one step process, which means that the formation of silica shells and dissolution of the core particles occures in the same medium. The hollow silica particles have uniform size of ca. 1.5 μm in diameter and ca. 10 nm in shell thickness. Porous polyimides with hollow silica spheres in matrix were synthesized via synthetic route based on the preparation method of the intrinsic polyimide. With the differnt content of hollow silica spheres of 0~10 wt%, dielectric constant values of porous polyimides were controlled in the range from 2.95 to 1.81. Organic-inorganic hybrid porous polyimides are expected as prime candidates for polymeric insulators due to thier high thermal stability, good mechanical properties, solvent resistance, low dielectric constant. |
