| 초록 |
Thiol-ene reaction in the adhesive field has advantages which are fast crosslinking, low gelation, low shrinkage and oxygen non-sensitivity compared to the conventional network formation by acrylate. Also, the acrylate-based resin can be variously adjusted in physical properties depending on the type of oligomer and the number of functionalities. The dual-curable adhesives were prepared through two step curing system based on sequential thiol-acrylate and thiol-epoxy reactions. The curing kinetics according to the acrylate functionality was investigated using Photo-DSC and FT-IR analysis as well as gel fraction and pendulum hardness measurements. The peel strength and adhesion strength of adhesives were also evaluated by a pull-off method using a universal testing machine. |
