| 초록 |
Processable thermally conductive adhesives of polymer nanocomposites have been extensively investigated for efficient heat dissipation in electronic devices and machinery because overheating may cause malfunctions and critical damage We have a number of thermal property measuring instruments such as GHP, HFM, LFA, TMA, and DSC. Using excellent equipment, we developed a composite material in which an inorganic material with high thermal conductivity is added to an unfilled adhesive. Each of boron nitride was surface-modified using Benzyl alcohol, benzoic acid, and boric acid. As a result, epoxy composites with high thermal conductivity could be produced. In addition, Our BN-based adhesives were impregnated into a Low-temperature superconductor coil, in which the normal zone propagation velocity and cooling rate tests confirmed the enhanced durability and reduced cool-down time of the coil incorporating our BN-filled epoxy-based adhesive. |
